Craig Barrett, CEO of Intel Corp., displays a 300 mm wafer with the latest technology test chips during a meeting with analysts Tuesday, December 7,...Craig Barrett, CEO of Intel Corp., displays a 300 mm wafer w
An Intel Corp. Employee holds a 12-inch wafer which holds hundreds of computer chips at the Intel plant in Rio Rancho, New Mexico, on Thursday, May...An Intel Corp. employee holds a 12-inch wafer which holds hu
Intel Corp. Technicians monitor the making of 12-inch wafers in Fab 11x at the Intel plant in Rio Rancho, New Mexico, on Thursday, May 17, 2007.Intel Corp. technicians monitor the making of 12-inch wafers
Paul Otellini, president and chief executive officer of Intel Corporation, holds up a computer wafer at the Intel Developer Forum 2007 in San...Paul Otellini, president and chief executive officer of Inte
Anand Chandrasekher, senior vice president and general manager of Ultra Mobility Group for Intel Corporation, holds up a Silverthone 45 nanometer...Anand Chandrasekher, senior vice president and general manag
Paul Otellini, president and chief executive officer of Intel Corp., holds up one of the company's wafers during a speech at the 9th Nikkei Global...Paul Otellini, president and chief executive officer of Inte
Intel CEO Paul Otellini holds a silicon wafer with a new 22 nanometer SRAM chip as he delivers the keynote address during the 2009 Intel Developer...Intel CEO Paul Otellini Addresses 2009 Intel Developer Forum
Intel CEO Paul Otellini holds a silicon wafer with a new 22 nanometer SRAM chip after he delivered the keynote address during the 2009 Intel...Intel CEO Paul Otellini Addresses 2009 Intel Developer Forum
Intel CEO Paul Otellini holds a silicon wafer with a new 22 nanometer SRAM chip after he delivered the keynote address during the 2009 Intel...Intel CEO Paul Otellini Addresses 2009 Intel Developer Forum
Intel CEO Paul Otellini holds a silicon wafer with a new 22 nanometer SRAM chip as he delivers the keynote address during the 2009 Intel Developer...Intel CEO Paul Otellini Addresses 2009 Intel Developer Forum
Introduced by Intel in 1974, the 8080 microprocessor was the first microprocessor powerful enough to build a computer around. It was used in the...Silicon wafer used in the production of Intel 8080 microprocessor chips, 1970s.
Introduced by Intel in 1974, the 8080 microprocessor was the first microprocessor powerful enough to build a computer around. It was used in the...Silicon wafer used in the production of Intel 8080 microprocessor chips, 1970s.
Christian Morales, vice president of the Intel Sales and Marketing Group and general manager of Intel Europe, Middle East and Africa, poses with a...Christian Morales, vice president of the
German Chancellor Angela Merkel holds a silicon wafer of microprocessors at the Intel stand at the CeBIT technology trade fair on March 3, 2009 in...Cebit Technology Fair
In this image provided by Intel, Tom Kilroy, vice president and general manager of Intel's Digital Enterprise Group, displays a wafer from Intel's...Intel Announces Xeon 7400 Processor
Pat Gelsinger, Intel Senior VP and General Manager of its Digital Enterprise Group holds up a silicon wafer at the Intel Developer Forum in San...Intel Developer Forum in San Francisco
45nm process 300mm silicon wafer is displayed at a press conference as Intel Japan announces the launch of the new 45nm process microprocessors, Xeon...A 45nm process 300mm silicon wafer is di
Intel Japan president Kazumasa Yoshida displays a 45nm process 300mm silicon wafer as the company announces the launch of the new 45nm process...Intel Japan president Kazumasa Yoshida d
Intel Japan president Kazumasa Yoshida displays the new 45nm process microprocessors Xeon processor for servers and Core2 Extreme processor for...Intel Japan president Kazumasa Yoshida d
Intel CEO Paul Otellini delivers a keynote address during the 2007 Intel Developer Forum September 18, 2007 at the Moscone Center in San Francisco,...Intel CEO Paul Otellini Speaks At Programmers Forum
Intel CEO Paul Otellini delivers a keynote address during the 2007 Intel Developer Forum September 18, 2007 at the Moscone Center in San Francisco,...Intel CEO Paul Otellini Speaks At Programmers Forum
Intel CEO Paul Otellini delivers a keynote address during the 2007 Intel Developer Forum September 18, 2007 at the Moscone Center in San Francisco,...Intel CEO Paul Otellini Speaks At Programmers Forum
Intel CEO Paul Otellini holds shows two new entry level laptop computers as he delivers a keynote address during the 2007 Intel Developer Forum...Intel CEO Paul Otellini Speaks At Programmers Forum
Intel CEO Paul Otellini watches a video during his keynote address at the 2007 Intel Developer Forum September 18, 2007 at the Moscone Center in San...Intel CEO Paul Otellini Speaks At Programmers Forum
Intel CEO Paul Otellini delivers a keynote address during the 2007 Intel Developer Forum September 18, 2007 at the Moscone Center in San Francisco,...Intel CEO Paul Otellini Speaks At Programmers Forum
Intel CEO Paul Otellini delivers a keynote address during the 2007 Intel Developer Forum September 18, 2007 at the Moscone Center in San Francisco,...Intel CEO Paul Otellini Speaks At Programmers Forum
Intel CEO Paul Otellinilaughs introcuces a new processor called "Penryn" during his keynote address at the 2007 Intel Developer Forum September 18,...Intel CEO Paul Otellini Speaks At Programmers Forum
Intel CEO Paul Otellini delivers a keynote address during the 2007 Intel Developer Forum September 18, 2007 at the Moscone Center in San Francisco,...Intel CEO Paul Otellini Speaks At Programmers Forum
Intel CEO Paul Otellini delivers a keynote address during the 2007 Intel Developer Forum September 18, 2007 at the Moscone Center in San Francisco,...Intel CEO Paul Otellini Speaks At Programmers Forum
Intel CEO Paul Otellini delivers a keynote address during the 2007 Intel Developer Forum September 18, 2007 at the Moscone Center in San Francisco,...Intel CEO Paul Otellini Speaks At Programmers Forum
Intel CEO Paul Otellinilaughs as he introcuces a new processor called "Nehalem" during his keynote address at the 2007 Intel Developer Forum...Intel CEO Paul Otellini Speaks At Programmers Forum
Intel CEO Paul Otellini delivers a keynote address during the 2007 Intel Developer Forum September 18, 2007 at the Moscone Center in San Francisco,...Intel CEO Paul Otellini Speaks At Programmers Forum
Intel CEO Paul Otellini delivers a keynote address during the 2007 Intel Developer Forum September 18, 2007 at the Moscone Center in San Francisco,...Intel CEO Paul Otellini Speaks At Programmers Forum
Intel CEO Paul Otellini delivers a keynote address during the 2007 Intel Developer Forum September 18, 2007 at the Moscone Center in San Francisco,...Intel CEO Paul Otellini Speaks At Programmers Forum
Intel CEO Paul Otellini holds a wafer of new chips with 32-nanometer circuitry as he delivers a keynote address during the 2007 Intel Developer Forum...Intel CEO Paul Otellini Speaks At Programmers Forum
Intel CEO Paul Otellini holds a wafer of new chips with 32-nanometer circuitry as he delivers a keynote address during the 2007 Intel Developer Forum...Intel CEO Paul Otellini Speaks At Programmers Forum
Chinese shopper walks past an advertising billboard of the US chip giant Intel on display at a shopping mall in Beijing, 26 March 2007. US chip giant...A Chinese shopper walks past an advertis...
Chinese shopper walks past an advertising billboard of the US chip giant Intel on display at a shopping mall in Beijing, 26 March 2007. US chip giant...A Chinese shopper walks past an advertis...
Chinese shoppers walk past an advertising billboard of the US chip giant Intel on display at a shopping mall in Beijing, 26 March 2007. US chip giant...Chinese shoppers walk past an advertisin...
The names of Mexican Intel Corp. Engineers are displayed in a monument called the "Wafer of Fame" at the company's design center in Guadalajara,...Silicon Valley's Trump Scare Fuels Push to Move to Mexico
Anand Chandrasekher, Vice President of Intel Corporation, knocks a wafer shaped gong to mark the "daul core" motherboard during the Computex Taipei...Anand Chandrasekher, Vice President of I
Sunlin Chou, senior vice president and general manager of Intel's Technology & Manufacturing Group, holds a silicon wafer used to make Intel desktop...Intel announces first multi-core silicon production to begin
Ajay Malhotra of the Intel Corporation holds a wafer that new Itanium2 processor is made from at a press conference on June 11, 2004 in Tokyo, Japan....Semiconductor Giant Holds Press Conference For Intel Itanium 2 Processor
Ajay Malhotra of the Intel Corporation holds a wafer that new Itanium2 processor is made from at a press conference on June 11, 2004 in Tokyo, Japan....Semiconductor Giant Holds Press Conference For Intel Itanium 2 Processor
Treasury Secretary John Snow Tim Hendry, Intel's Fab11x factory manager and Rep. Heather Wilson all share a laugh during the presentation of a framed...Secretary John W. Snow Tours The Intel Corporation Facility In Rio Rancho, NM
Intel CEO Pat Gelsinger shows US President Joe Biden a processor and semiconductor wafer during a tour at Intel Ocotillo Campus in Chandler, Arizona,...US-POLITICS-VOTE-BIDEN
President Joe Biden stands behind a table, next to Intel's CEO Pat Gelsinger as they look at wafers while touring the Intel Ocotillo Campus in...US-POLITICS-VOTE-BIDEN
President of Japan's sole DRAM maker Elpida Memory, Yukio Sakamoto, shows off the company's latest 300mm silicon wafer for DRAM chips during a press...President of Japan's sole DRAM maker Elp
President of Japan's sole DRAM maker Elpida Memory, Yukio Sakamoto, shows off the company's latest 300mm silicon wafer for DRAM chips during a press...JAPAN-US-ELPIDA-INTEL-1
Visitors take photos of a wafer model integrating 1 trillion transistors inside a single chip at the 6th CIIE in Shanghai, China, November 8, 2023.Intel Booth at 6TH CIIE in Shanghai
Visitors look at a model of a wafer that integrates 1 trillion transistors inside a single chip at the 6th CIIE in Shanghai, China, November 8, 2023.Intel Booth at 6TH CIIE in Shanghai
Visitors look at a model of a wafer that integrates 1 trillion transistors inside a single chip at the 6th CIIE in Shanghai, China, November 8, 2023.Intel Booth at 6TH CIIE in Shanghai
Chinese shoppers walk past an advertising billboard of the US chip giant Intel on display at a shopping mall in Beijing, 26 March 2007. US chip giant...CHINA-US-IT-SEMICONDUCTOR-COMPANY-INTEL
Chinese shopper walks past an advertising billboard of the US chip giant Intel on display at a shopping mall in Beijing, 26 March 2007. US chip giant...CHINA-US-IT-SEMICONDUCTOR-COMPANY-INTEL
Chinese shopper walks past an advertising billboard of the US chip giant Intel on display at a shopping mall in Beijing, 26 March 2007. US chip giant...CHINA-US-IT-SEMICONDUCTOR-COMPANY-INTEL