2010 International Consumer Electronics Show (CES)

An uncut wafer from which Intel Corp.'s new Core family of processors are fabricated is displayed at Intel's booth during the 2010 International Consumer Electronics Show (CES) in Las Vegas, Nevada, U.S., on Thursday, Jan. 7, 2010. Intel Corp. introduced its all new 2010 Intel Core family of processors today, including Intel Core i7, i5 and i3 chips, which coincide with the arrival of Intel's new 32 nanometer (nm) manufacturing process. Photographer: Daniel Acker/Bloomberg via Getty Images
An uncut wafer from which Intel Corp.'s new Core family of processors are fabricated is displayed at Intel's booth during the 2010 International Consumer Electronics Show (CES) in Las Vegas, Nevada, U.S., on Thursday, Jan. 7, 2010. Intel Corp. introduced its all new 2010 Intel Core family of processors today, including Intel Core i7, i5 and i3 chips, which coincide with the arrival of Intel's new 32 nanometer (nm) manufacturing process. Photographer: Daniel Acker/Bloomberg via Getty Images
2010 International Consumer Electronics Show (CES)
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Credit:
Bloomberg / Contributor
Editorial #:
95628932
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Bloomberg
Date created:
07 January, 2010
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Source:
Bloomberg
Object name:
2010 CONSUMER ELECTRONICS SHOW
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3628 x 2419 px (38.40 x 25.60 cm) - 240 dpi - 1 MB